发明申请
US20090309197A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE
有权
具有内部堆叠模块的集成电路封装系统
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE
- 专利标题（中）： 具有内部堆叠模块的集成电路封装系统
-
申请号： US12137529申请日： 2008-06-11
-
公开(公告)号： US20090309197A1公开(公告)日： 2009-12-17
- 发明人: Seng Guan Chow , Heap Hoe Kuan , Reza Argenty Pagaila
- 申请人： Seng Guan Chow , Heap Hoe Kuan , Reza Argenty Pagaila
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/56
摘要：
An integrated circuit package system includes: fabricating an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a flexible substrate, coupling a stacking module integrated circuit to the flexible substrate, and bending a flexible extension over the stacking module integrated circuit; molding a package body on the integrated circuit substrate and the internal stacking module; and coupling an external integrated circuit to the internal stacking module exposed through the package body.