发明申请
US20090309222A1 METHOD AND SEMICONDUCTOR DEVICE HAVING COPPER INTERCONNECT FOR BONDING
失效
具有铜连接的方法和半导体器件用于结合
- 专利标题： METHOD AND SEMICONDUCTOR DEVICE HAVING COPPER INTERCONNECT FOR BONDING
- 专利标题（中）： 具有铜连接的方法和半导体器件用于结合
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申请号： US12546463申请日： 2009-08-24
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公开(公告)号： US20090309222A1公开(公告)日： 2009-12-17
- 发明人: Salman Akram
- 申请人： Salman Akram
- 申请人地址： US ID Boise
- 专利权人： MICRON TECHNOLOGY, INC.
- 当前专利权人： MICRON TECHNOLOGY, INC.
- 当前专利权人地址： US ID Boise
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described wherein the bond pad on a surface of the semiconductor device comprises a layer of copper and at least one layer of metal and/or at least a barrier layer of material between the copper layer and one layer of metal on the copper layer to form a bond pad.
公开/授权文献
- US08759970B2 Semiconductor device having copper interconnect for bonding 公开/授权日：2014-06-24
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