发明申请
- 专利标题： SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDABLE HEIGHTS AT LEAD FINGER TIPS
- 专利标题（中）： 半导体封装系统，具有不同绑定高度的基板在引线指尖
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申请号： US12547439申请日： 2009-08-25
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公开(公告)号： US20090309237A1公开(公告)日： 2009-12-17
- 发明人: Seng Guan Chow , Ming Ying , Il Kwon Shim , Lip Seng Tan
- 申请人： Seng Guan Chow , Ming Ying , Il Kwon Shim , Lip Seng Tan
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; H01L21/56 ; H01L21/60 ; H01L23/28
摘要：
A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.