发明申请
US20090315162A1 Micro-Modules with Molded Passive Components, Systems Using the Same, and Methods of Making the Same
审中-公开
具有成型被动元件的微型模块，使用其的系统及其制造方法
- 专利标题： Micro-Modules with Molded Passive Components, Systems Using the Same, and Methods of Making the Same
- 专利标题（中）： 具有成型被动元件的微型模块，使用其的系统及其制造方法
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申请号： US12143675申请日： 2008-06-20
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公开(公告)号： US20090315162A1公开(公告)日： 2009-12-24
- 发明人: Yong Liu , Yumin Liu , Terry Johnson , Doug Hawks
- 申请人： Yong Liu , Yumin Liu , Terry Johnson , Doug Hawks
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
Semiconductor die packages, methods of making said packages, and systems using said packages are disclosed. An exemplary package comprises at least one semiconductor die disposed on one surface of a leadframe and electrically coupled to at least one conductive region of the leadframe, and at least one passive electrical component disposed on the other surface of a leadframe and electrically coupled to at least one conductive region of the leadframe. Molding material is disposed over the at least one passive electrical component to provide a molded passive component.