发明申请
- 专利标题: SEMICONDUCTOR MEMORY DEVICE
- 专利标题(中): 半导体存储器件
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申请号: US12489658申请日: 2009-06-23
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公开(公告)号: US20090321960A1公开(公告)日: 2009-12-31
- 发明人: Naohisa OKUMURA
- 申请人: Naohisa OKUMURA
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-168132 20080627
- 主分类号: H01L23/52
- IPC分类号: H01L23/52
摘要:
A plurality of semiconductor memory chips are stacked on a first main surface of a wiring board, and an interposer chip is stacked on the plurality of semiconductor chips, and a semiconductor controller chip is stacked on the interposer chip. The plurality of semiconductor memory chips are independently and electrically connected with inner connecting terminals formed on the wiring board, respectively, and independently controlled by the semiconductor controller chip which is electrically connected with another inner connecting terminals formed on the wiring board via the interposer chip.
公开/授权文献
- US07880312B2 Semiconductor memory device 公开/授权日:2011-02-01