发明申请
- 专利标题： PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS THEREIN, AND PROCESS FOR MANUFACTURING THE SAME
- 专利标题（中）： 具有嵌入式电容器的印刷电路板及其制造方法
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申请号： US12491406申请日： 2009-06-25
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公开(公告)号： US20090325105A1公开(公告)日： 2009-12-31
- 发明人: Seok-Kyu Lee , Byoung-Youl Min , Chang-Hyun Nam , Hyun-Ju Jin , Jang-Kyu Kang
- 申请人： Seok-Kyu Lee , Byoung-Youl Min , Chang-Hyun Nam , Hyun-Ju Jin , Jang-Kyu Kang
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR2002-82648 20021223
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; G03F7/00
摘要：
Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.