发明申请
- 专利标题: Method of Thinning Wafer and Support plate
- 专利标题(中): 薄板和支撑板变薄的方法
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申请号: US12309285申请日: 2007-05-24
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公开(公告)号: US20090325467A1公开(公告)日: 2009-12-31
- 发明人: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
- 申请人: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
- 申请人地址: JP Kanagawa
- 专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址: JP Kanagawa
- 优先权: JP2006-194692 20060714
- 国际申请: PCT/JP2007/000557 WO 20070524
- 主分类号: B24B1/00
- IPC分类号: B24B1/00 ; B24B41/06
摘要:
A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.
公开/授权文献
- US08167687B2 Method of thinning wafer and support plate 公开/授权日:2012-05-01