发明申请
- 专利标题： Lead pin for package boards
- 专利标题（中）： 封装板引脚
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申请号： US12232316申请日： 2008-09-15
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公开(公告)号： US20100000761A1公开(公告)日： 2010-01-07
- 发明人: Hueng Jae Oh , Jin Won Choi
- 申请人： Hueng Jae Oh , Jin Won Choi
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2008-0064245 20080703
- 主分类号： H01B5/00
- IPC分类号： H01B5/00
摘要：
Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.
公开/授权文献
- US07893355B2 Lead pin for package boards 公开/授权日：2011-02-22
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