A connector device for interconnecting circuit substrates is obtained, in which a pitch for electrically conducting paths can easily be aligned with a pitch for electrodes on the side of circuit substrates. The connector includes a rectangular parallelepiped connecting element (9) and a connector housing (11). The rectangular parallelepiped connecting element (9) has a plurality of electrically conducting paths disposed on a rectangular parallelepiped insulating base thereof at an insulating interval and the connector housing (11) is mounted on a first circuit substrate (1) with the rectangular parallelepiped connecting element (9) received therein. The connector housing (11) allows an electrically conducting path portion of the rectangular parallelepiped connecting element (9) to be electrically connected to first connecting electrodes disposed on the first circuit substrate (1), receives a substrate portion of a second substrate (5) where second connecting electrodes are disposed, and brings the electrically conducting path portion of the rectangular parallelepiped connecting element (9) and the second connecting electrodes of the second circuit substrate (5) into contact with each other.