发明申请
US20100006985A1 FORMATION OF SOI BY OXIDATION OF SILICON WITH ENGINEERED POROSITY GRADIENT
失效
通过氧化硅与工程化孔隙度梯度形成SOI
- 专利标题: FORMATION OF SOI BY OXIDATION OF SILICON WITH ENGINEERED POROSITY GRADIENT
- 专利标题(中): 通过氧化硅与工程化孔隙度梯度形成SOI
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申请号: US12170459申请日: 2008-07-10
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公开(公告)号: US20100006985A1公开(公告)日: 2010-01-14
- 发明人: Joel P. DeSouza , Keith E. Fogel , Alexander Reznicek , Devendra Sadana
- 申请人: Joel P. DeSouza , Keith E. Fogel , Alexander Reznicek , Devendra Sadana
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L29/12
- IPC分类号: H01L29/12 ; H01L21/20
摘要:
A method is provided for making a silicon-on-insulator substrate. Such method can include epitaxially growing a highly p-type doped silicon-containing layer onto a major surface of an underlying semiconductor region of a substrate. Subsequently, a non-highly p-type doped silicon-containing layer may be epitaxially grown onto a major surface of the p-type highly-doped epitaxial layer to cover the highly p-type doped epitaxial layer. The overlying non-highly p-type doped epitaxial layer can have a dopant concentration substantially lower than the dopant concentration of the highly p-type doped epitaxial layer. The substrate can then be processed to form a buried oxide layer selectively by oxidizing at least portions of the highly p-type doped epitaxial layer covered by the non-highly p-type doped epitaxial layer, the buried oxide layer separating the overlying monocrystalline semiconductor layer from the underlying semiconductor region. Such processing can be performed while simultaneously annealing the non-highly p-type doped epitaxial layer.
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