发明申请
US20100012362A1 RESIN COMPOSITION, RESIN FILM, COVER LAY FILM, INTERLAYER ADHESIVE, METAL-CLAD LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD
审中-公开
树脂组合物，树脂膜，覆盖膜，层间粘合剂，金属层压板和多层印刷电路板
- 专利标题： RESIN COMPOSITION, RESIN FILM, COVER LAY FILM, INTERLAYER ADHESIVE, METAL-CLAD LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD
- 专利标题（中）： 树脂组合物，树脂膜，覆盖膜，层间粘合剂，金属层压板和多层印刷电路板
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申请号： US12090628申请日： 2006-10-18
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公开(公告)号： US20100012362A1公开(公告)日： 2010-01-21
- 发明人: Tomoyuki Abe , Toshio Komiyatani
- 申请人： Tomoyuki Abe , Toshio Komiyatani
- 申请人地址： JP Tokyo
- 专利权人： SUMITOMO BAKELITE Co., Ltd.
- 当前专利权人： SUMITOMO BAKELITE Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2005-308971 20051024; JP2006-242041 20060906
- 国际申请： PCT/JP2006/320768 WO 20061018
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; B32B27/04 ; B32B7/06 ; B32B7/12 ; H05K1/03 ; C08G77/04 ; C08L79/08 ; C08L83/04 ; C08K3/22
摘要：
The present invention provides a resin composition for use as an adhesive material of a printed circuit board, comprising a polyimide siloxane resin. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, in which flowing out during heating/pressing is prevented and which provide excellent adhesion strength. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, which exhibit excellent heat resistance.