发明申请
US20100012935A1 CU ALLOY WIRING FILM, TFT ELEMENT FOR FLAT-PANEL DISPLAY USING THE CU ALLOY WIRING FILM, AND CU ALLOY SPUTTERING TARGET FOR DEPOSITING THE CU ALLOY WIRING FILM
有权
CU合金线，用于使用铜合金线的平板显示器的TFT元件和用于沉积铜合金接线的CU合金溅射靶
- 专利标题： CU ALLOY WIRING FILM, TFT ELEMENT FOR FLAT-PANEL DISPLAY USING THE CU ALLOY WIRING FILM, AND CU ALLOY SPUTTERING TARGET FOR DEPOSITING THE CU ALLOY WIRING FILM
- 专利标题（中）： CU合金线，用于使用铜合金线的平板显示器的TFT元件和用于沉积铜合金接线的CU合金溅射靶
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申请号： US12517362申请日： 2007-12-04
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公开(公告)号： US20100012935A1公开(公告)日： 2010-01-21
- 发明人: Aya Hino , Katsufumi Tomihisa , Hiroshi Gotou , Takashi Onishi
- 申请人： Aya Hino , Katsufumi Tomihisa , Hiroshi Gotou , Takashi Onishi
- 申请人地址： JP Hyogo
- 专利权人： Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel Ltd)
- 当前专利权人： Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel Ltd)
- 当前专利权人地址： JP Hyogo
- 优先权： JP2006-327451 20061204
- 国际申请： PCT/JP2007/073419 WO 20071204
- 主分类号： H01L29/786
- IPC分类号： H01L29/786 ; H01L23/48 ; C23C14/34
摘要：
An object of the present invention is to provide: a Cu alloy wiring film that makes it possible to use Cu having a low electrical resistivity as a wiring material, exhibit a high adhesiveness to a glass substrate, and avoid the danger of peel off from the glass substrate; a TFT element for a flat-panel display produced with the Cu alloy wiring film; and a Cu alloy sputtering target used for the deposition of the Cu alloy wiring film.The present invention is a wiring film 2 composing a TFT element 1 for a flat-panel display and a sputtering target used for the deposition of the film and the material comprises Cu as the main component and at least one element selected from the group consisting of Pt, Ir, Pd, and Sm by 0.01 to 0.5 atomic percent in total. The wiring film 2 is layered on a glass substrate 3 and further a transparent conductive film 5 is layered thereon while an insulating film 4 is interposed in between.
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