Invention Application
- Patent Title: ARRANGEMENT AND A METHOD FOR COOLING
- Patent Title (中): 安装方法和冷却方法
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Application No.: US12306002Application Date: 2006-06-22
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Publication No.: US20100014337A1Publication Date: 2010-01-21
- Inventor: Per Halvarsson
- Applicant: Per Halvarsson
- Applicant Address: CH Zurich
- Assignee: ABB TECHNOLOGY LTD.
- Current Assignee: ABB TECHNOLOGY LTD.
- Current Assignee Address: CH Zurich
- International Application: PCT/SE2006/000770 WO 20060622
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An arrangement for cooling a high voltage converter including a major loop with a pump for making a coolant liquid to pass power semiconductor devices of the converter and a heat exchanger for lowering the temperature of the coolant liquid before passing the power semiconductor devices again. An extra loop is connected to the major loop. The extra loop has a cooling apparatus containing a volume of a cooling medium and adapted to cool the medium to a temperature substantially lower than the temperature of the coolant liquid after having passed the heat exchanger in the major loop. A control unit is adapted to divert at least a part of the coolant liquid to flow through the extra loop when the need of cooling the power semiconductor devices of the converter is extremely high.
Public/Granted literature
- US08411402B2 Arrangement and a method for cooling Public/Granted day:2013-04-02
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