发明申请
US20100018053A1 CO-EXTRUSION METHOD OF FABRICATING ELECTRODE STRUCTURES IN HONEYCOMB SUBSTRATES AND ULTRACAPACITOR FORMED THEREBY 有权
蜂窝状基质中制备电极结构的CO挤出方法及其形成的超声波

  • 专利标题: CO-EXTRUSION METHOD OF FABRICATING ELECTRODE STRUCTURES IN HONEYCOMB SUBSTRATES AND ULTRACAPACITOR FORMED THEREBY
  • 专利标题(中): 蜂窝状基质中制备电极结构的CO挤出方法及其形成的超声波
  • 申请号: US12571647
    申请日: 2009-10-01
  • 公开(公告)号: US20100018053A1
    公开(公告)日: 2010-01-28
  • 发明人: William James MillerHuan-Hung Sheng
  • 申请人: William James MillerHuan-Hung Sheng
  • 主分类号: H01R43/16
  • IPC分类号: H01R43/16
CO-EXTRUSION METHOD OF FABRICATING ELECTRODE STRUCTURES IN HONEYCOMB SUBSTRATES AND ULTRACAPACITOR FORMED THEREBY
摘要:
A method for fabricating electrode structures within a honeycomb substrate having a plurality of elongated channels is provided that is particularly adaptable for producing an ultracapacitor. In this method, the nozzle of a co-extrusion device simultaneously feeds a current collector along a central axis of one of the channels while simultaneously injecting a paste containing an electrode material so that the interior of the channel becomes completely filled with electrode paste at the same rate that the current collector is fed. Such co-extrusion as performed simultaneously at both sides of the ceramic substrate to rapidly form electrode structures within substantially all the channels of the substrate. The resulting ultracapacitor is capable of storing large amounts of electrical energy per unit volume in a structure which is relatively quick and easy to manufacture.
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