发明申请
- 专利标题: Conductive Nanowires For Electrical Interconnect
- 专利标题(中): 导电纳米线用于电气互连
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申请号: US12259997申请日: 2008-10-28
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公开(公告)号: US20100018747A1公开(公告)日: 2010-01-28
- 发明人: Shih-Yuan Wang , Sagi Mathai , Wei Wu
- 申请人: Shih-Yuan Wang , Sagi Mathai , Wei Wu
- 主分类号: H01B5/00
- IPC分类号: H01B5/00 ; B23P11/00
摘要:
An electrical interconnect includes first and second electrical contacts to be electrically connected, each electrical contact having a plurality of electrically conductive nanowires extending outwardly from a respective electrical contact; and the nanowires of the first electrical contact configured to mesh with the nanowires of the second electrical contact such that an electrical connection is established between the first electrical contact and the second electrical contact. A method for interconnecting electrical contacts includes meshing a first array of electrically conductive nanowires extending from a first electrical contact with a second array of electrically conductive nanowires extending from a second electrical contact so as to establish an electrical connection between said first and second electrical contacts.
公开/授权文献
- US07960653B2 Conductive nanowires for electrical interconnect 公开/授权日:2011-06-14
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