发明申请
- 专利标题： ENGRAVED PLATE AND SUBSTRATE WITH CONDUCTOR LAYER PATTERN USING THE SAME
- 专利标题（中）： 雕刻板和基板与导体层模式使用相同
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申请号： US12439685申请日： 2007-12-27
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公开(公告)号： US20100021695A1公开(公告)日： 2010-01-28
- 发明人: Susumu Naoyuki , Hisashige Kanbara , Minoru Tosaka , Kyosuke Suzuki , Toshirou Okamura , Yoshihito Kikuhara , Masami Negishi , Tadayasu Fujieda , Kouichi Tsuyama
- 申请人： Susumu Naoyuki , Hisashige Kanbara , Minoru Tosaka , Kyosuke Suzuki , Toshirou Okamura , Yoshihito Kikuhara , Masami Negishi , Tadayasu Fujieda , Kouichi Tsuyama
- 优先权： JP2006-352549 20061227; JP2007-099332 20070405; JP2007-152658 20070608; JP2007-158735 20070615; JP2007-183130 20070712
- 国际申请： PCT/JP2007/075205 WO 20071227
- 主分类号： B32B3/02
- IPC分类号： B32B3/02 ; G03F7/20 ; C23C14/34 ; C23C14/04 ; C25D5/02
摘要：
An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.
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