A method of measuring the elastic modulus and hardness of a thin film on substrate using nanoindentation technique is provided. The method includes calculating a series of experimental corrected stiffness and contact radius pairs associated with one or more presumed parameters and information obtained from a loading curve associated with the thin film and substrate. Also, the method includes calculating a series of theoretical corrected stiffness and contact radius pairs associated with the same one or more presumed parameters and information obtained from the loading curve associated with the thin film and substrate. Furthermore, the method includes using results obtained from the experimental and theoretical corrected stiffness and contact radius pairs to compute the elastic modulus and hardness of the film material.