Invention Application
- Patent Title: Discrete Semiconductor Device and Method of Forming Sealed Trench Junction Termination
- Patent Title (中): 分立半导体器件和形成密封沟槽接线端接的方法
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Application No.: US12182660Application Date: 2008-07-30
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Publication No.: US20100025807A1Publication Date: 2010-02-04
- Inventor: Ronald R. Bowman
- Applicant: Ronald R. Bowman
- Applicant Address: US AZ Tempe
- Assignee: TRION TECHNOLOGY, INC.
- Current Assignee: TRION TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/762

Abstract:
A discrete semiconductor device has a substrate with a first conductivity type of semiconductor material. A first semiconductor layer is formed over the substrate. The first semiconductor layer having the first conductivity type of semiconductor material. A second semiconductor layer over the first semiconductor layer. The second semiconductor layer has a second conductivity type of semiconductor material. A trench is formed through the second semiconductor layer and extends into the second semiconductor layer. The trench has a rounded or polygonal shape and vertical sidewalls. The trench is lined with an insulating layer and filled with an insulating material. A boundary between the first and second semiconductor layers forms a p-n junction. The trench surrounds the p-n junction to terminate the electric field of a voltage imposed on the second semiconductor layer. The discrete semiconductor device can also be a transistor, thyristor, triac, or transient voltage suppressor.
Public/Granted literature
- US08163624B2 Discrete semiconductor device and method of forming sealed trench junction termination Public/Granted day:2012-04-24
Information query
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