发明申请
US20100028588A1 Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend 审中-公开
热剥离性粘合片和回收被粘物的方法

  • 专利标题: Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend
  • 专利标题(中): 热剥离性粘合片和回收被粘物的方法
  • 申请号: US12311974
    申请日: 2007-10-18
  • 公开(公告)号: US20100028588A1
    公开(公告)日: 2010-02-04
  • 发明人: Kazuyuki Kiuchi
  • 申请人: Kazuyuki Kiuchi
  • 申请人地址: JP Ibaraki-shi
  • 专利权人: NITTO DENKO CORPORATION
  • 当前专利权人: NITTO DENKO CORPORATION
  • 当前专利权人地址: JP Ibaraki-shi
  • 优先权: JP2006-299738 20061104
  • 国际申请: PCT/JP2007/070311 WO 20071018
  • 主分类号: C09J7/02
  • IPC分类号: C09J7/02 C09J11/00 C09J201/00 B32B38/10
Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend
摘要:
To provide a heat-peelable pressure-sensitive adhesive sheet which, even when applied to a flexible adherend or extremely small adherend, enables the adherend to be efficiently peeled and recovered therefrom without breakage.The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and arranged on one side thereof in the following order, an intermediate layer having a thickness “A”, and a heat-peelable pressure-sensitive adhesive layer having a thickness “B” and containing heat-expandable microspheres with a largest particle diameter “C”. The parameters A, B, and C satisfy the following conditions: C≦(A+B)≦60 (μm) and 0.25C≦B≦0.8C, and the heat-peelable pressure-sensitive-adhesive layer, when subjected to a heating treatment, shows an adhesive strength of less than 0.1 N/20 mm after the heating treatment. The heat-peelable pressure-sensitive adhesive layer after the heating treatment preferably has an arithmetic mean surface roughness Ra of 5 μm or smaller and a maximum height of the profile Rmax of 25 μm or smaller. The substrate preferably has a glass transition temperature (Tg) of 60° C. or higher and a thickness of 50 μm or smaller.
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