Invention Application
US20100028709A1 HOUSING OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING THE SAME
有权
电子设备的壳体和使用该电子设备的电子设备
- Patent Title: HOUSING OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING THE SAME
- Patent Title (中): 电子设备的壳体和使用该电子设备的电子设备
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Application No.: US12275315Application Date: 2008-11-21
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Publication No.: US20100028709A1Publication Date: 2010-02-04
- Inventor: BIN LI , CHAO-HSUN LIN , JEN-LUNG HUANG , XIAN-LIANG LIU , GUI-YUN YANG
- Applicant: BIN LI , CHAO-HSUN LIN , JEN-LUNG HUANG , XIAN-LIANG LIU , GUI-YUN YANG
- Applicant Address: CN ShenZhen City HK Kowloon
- Assignee: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.,FIH (HONG KONG) LIMITED
- Current Assignee: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.,FIH (HONG KONG) LIMITED
- Current Assignee Address: CN ShenZhen City HK Kowloon
- Priority: CN200810303278.0 20080731
- Main IPC: B32B7/06
- IPC: B32B7/06
Abstract:
An exemplary housing of electronic device includes a metallic main body and a metallic three-dimensional weaving member formed on at least a part of a surface of the metallic main body. An electronic device using the housing is also provided. The housing of the electronic device has a textured touching feeling.
Public/Granted literature
- US07989085B2 Housing of electronic device and electronic device using the same Public/Granted day:2011-08-02
Information query
