发明申请
- 专利标题： PRINT HEAD WITH REDUCED BONDING STRESS AND METHOD
- 专利标题（中）： 打印头与减少的粘结应力和方法
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申请号： US12538655申请日： 2009-08-10
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公开(公告)号： US20100032075A1公开(公告)日： 2010-02-11
- 发明人: Haggai Karlinski , Gil Fisher , Roi Nathan , Ilan Weiss
- 申请人： Haggai Karlinski , Gil Fisher , Roi Nathan , Ilan Weiss
- 主分类号： B32B37/00
- IPC分类号： B32B37/00
摘要：
A method for reducing stress between a silicon chip and a bonded mounting structure having a coefficient of thermal expansion substantially different from a coefficient of thermal expansion of the silicon chip includes the step of bonding a thermal stress-attenuating layer between the silicon chip and the mounting structure. The thermal stress-attenuating layer has a coefficient of thermal expansion that is substantially similar to the coefficient of thermal expansion of the silicon chip.
公开/授权文献
- US08388778B2 Print head with reduced bonding stress and method 公开/授权日：2013-03-05
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