发明申请
- 专利标题: SEMICONDUCTOR DEVICE
- 专利标题(中): 半导体器件
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申请号: US12526992申请日: 2008-02-05
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公开(公告)号: US20100033239A1公开(公告)日: 2010-02-11
- 发明人: Yoshihiro Nakagawa , Masayuki Mizuno
- 申请人: Yoshihiro Nakagawa , Masayuki Mizuno
- 申请人地址: JP Tokyo
- 专利权人: NEC CORPORATION
- 当前专利权人: NEC CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2007-032255 20070213
- 国际申请: PCT/JP2008/051810 WO 20080205
- 主分类号: H01L25/00
- IPC分类号: H01L25/00
摘要:
A main chip has a signal processing circuit for executing signal processing; a plurality of signal transmitting circuits for transmitting signals between the signal processing circuit and a signal transmitting circuit; and a control circuit for controlling operation/non-operation of the signal transmitting circuits in accordance with signal processing content of the signal processing circuit. Functional chips each have a signal processing circuit for executing auxiliary signal processing different from that of the signal processing circuit; and one or a plurality of signal transmitting circuits for transmitting signals between the signal processing circuit and the signal transmitting circuits. The main chip and the functional chips are stacked. The signal transmitting circuits and the signal transmitting circuit are non-contact-type signal transmitting circuits utilizing inductive coupling and are arranged so as to overlap when viewed from the stacking direction.
公开/授权文献
- US08243467B2 Semiconductor device 公开/授权日:2012-08-14