Provided is a manufacturing method of a layered ceramic electronic component capable of preventing appearance of a gap between a dielectric layer and a via electrode to achieve reliable conduction between the via electrode and an internal electrode and at the same time, capable of effectively preventing occurrence of structural defects in the dielectric layer and the like.In a layered (multilayer) ceramic capacitor, dielectric layers and internal electrodes are stacked alternately. Of the internal electrodes, those placed opposite to each other via the dielectric layer are connected through the via electrode. The layered (multilayer) ceramic capacitor is produced by forming a via hole in stacked layers of a ceramic green sheet for forming the dielectric layer and a conductive paste for forming the internal electrode, followed by firing to obtain stacked layers having the dielectric layers and the internal electrodes formed therein. A conductive paste for forming the via electrode is filled in the via hole of the stacked layers and then baked to form the via electrode.