发明申请
- 专利标题: WIRE DRAWING DIE
- 专利标题(中): 电线图
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申请号: US12523545申请日: 2008-01-18
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公开(公告)号: US20100043520A1公开(公告)日: 2010-02-25
- 发明人: Hitoshi Sumiya , Makoto Yukawa
- 申请人: Hitoshi Sumiya , Makoto Yukawa
- 优先权: JP2007-010101 20070119
- 国际申请: PCT/JP2008/050621 WO 20080118
- 主分类号: B21C3/02
- IPC分类号: B21C3/02
摘要:
One object of the present invention is to provide a wire drawing die excellent in strength and wear resistance. The wire drawing die has a core formed using highly hard diamond polycrystalline body made substantially only of diamond and produced by directly converting a raw material composition including a non-diamond type carbon material into diamond and sintering the diamond at an ultra high pressure and an ultra high temperature without adding a sintering aid or a catalyst, the polycrystalline body having a mixed construction including fine-grained diamond crystals with a maximum grain size of less than or equal to 100 nm and an average grain size of less than or equal to 50 nm and plate-like or particulate coarse-grained diamond crystals with a minimum grain size of greater than or equal to 50 nm and a maximum grain size of less than or equal to 10000 nm.
公开/授权文献
- US09061336B2 Wire drawing die 公开/授权日:2015-06-23
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