发明申请
- 专利标题： SEMICONDUCTOR DEVICE HAVING VIA CONNECTING BETWEEN INTERCONNECTS
- 专利标题（中）： 具有互连之间的半导体器件
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申请号： US12607697申请日： 2009-10-28
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公开(公告)号： US20100044866A1公开(公告)日： 2010-02-25
- 发明人: Takeshi HARADA
- 申请人： Takeshi HARADA
- 申请人地址： JP Osaka
- 专利权人： PANASONIC CORPORATION
- 当前专利权人： PANASONIC CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2003-404437 20031203
- 主分类号： H01L23/532
- IPC分类号： H01L23/532 ; H01L23/522
摘要：
A first insulating film is provided between a lower interconnect and an upper interconnect. The lower interconnect and the upper interconnect are connected to each other by way of a via formed in the first insulating film. A dummy via or an insulating slit is formed on/in the upper interconnect near the via.
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