Invention Application
US20100051172A1 METHOD FOR MANUFACTURING CERAMIC GREEN SHEET AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CIRCUIT BOARD
审中-公开
制造陶瓷绿色板材的方法及制造多层陶瓷电路板的方法
- Patent Title: METHOD FOR MANUFACTURING CERAMIC GREEN SHEET AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CIRCUIT BOARD
- Patent Title (中): 制造陶瓷绿色板材的方法及制造多层陶瓷电路板的方法
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Application No.: US12410013Application Date: 2009-03-24
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Publication No.: US20100051172A1Publication Date: 2010-03-04
- Inventor: Yong Suk Kim , Yong Soo Oh , Byeung Gyu Chang , Yong Seok Choi , Hwan Soo Lee , Sang Moon Lee , Taek Jung Lee
- Applicant: Yong Suk Kim , Yong Soo Oh , Byeung Gyu Chang , Yong Seok Choi , Hwan Soo Lee , Sang Moon Lee , Taek Jung Lee
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2008-0085469 20080829
- Main IPC: B32B37/02
- IPC: B32B37/02 ; B29C59/00
Abstract:
A method for manufacturing a ceramic green sheet includes providing a stamp having an imprinting surface on which a raised structure corresponding to a circuit pattern is formed, imprinting the stamp on the ceramic green sheet to form a depressed pattern in the ceramic green sheet, the depressed pattern being transferred from the raised structure, curing the ceramic green sheet with the stamp imprinted on the ceramic green sheet, separating the stamp from the ceramic green sheet, and providing the depressed pattern of the ceramic green sheet with the conductive material.
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