发明申请
- 专利标题： PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 印刷电路板及其制造方法
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申请号： US12429042申请日： 2009-04-23
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公开(公告)号： US20100051329A1公开(公告)日： 2010-03-04
- 发明人: Tae-Hoon KIM , Dong-Hoon Kim , Young-Il Lee , Sang-Gyun Lee , Byung-Ho Jun , Da-Mi Shim
- 申请人： Tae-Hoon KIM , Dong-Hoon Kim , Young-Il Lee , Sang-Gyun Lee , Byung-Ho Jun , Da-Mi Shim
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2008-0087277 20080904
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K3/12 ; H05K1/09
摘要：
Disclosed are a printed circuit board and a method of manufacturing the same. The method in accordance with an embodiment of the present invention includes: forming an electroless plated layer on an insulation layer; and forming a circuit pattern by applying conductive ink on the electroless plated layer through an inkjet method.
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