Invention Application
- Patent Title: CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE INTERCONNECTION MATERIAL THAT USES THE CONDUCTIVE PARTICLE, AND METHOD FOR PRODUCING THE CONDUCTIVE PARTICLE
- Patent Title (中): 导电颗粒，使用导电颗粒的导电性互连材料和用于生产导电颗粒的方法
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Application No.: US12515118Application Date: 2008-04-11
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Publication No.: US20100051878A1Publication Date: 2010-03-04
- Inventor: Yasushi Akutsu , Hidetsugu Namiki
- Applicant: Yasushi Akutsu , Hidetsugu Namiki
- Applicant Address: JP Tokyo
- Assignee: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Current Assignee: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2007-107475 20070416
- International Application: PCT/JP2008/057150 WO 20080411
- Main IPC: H01B1/12
- IPC: H01B1/12 ; B32B9/00 ; B05D7/00
Abstract:
There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle (2) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film (3) formed by welding of fine particles (3a) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.
Public/Granted literature
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