Invention Application
- Patent Title: METAL GATE TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Patent Title (中): 金属栅极晶体管及其制造方法
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Application No.: US12198128Application Date: 2008-08-26
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Publication No.: US20100052074A1Publication Date: 2010-03-04
- Inventor: Chien-Ting Lin , Li-Wei Cheng , Jung-Tsung Tseng , Che-Hua Hsu , Chih-Hao Yu , Tian-Fu Chiang , Yi-Wen Chen , Chien-Ming Lai , Cheng-Hsien Chou
- Applicant: Chien-Ting Lin , Li-Wei Cheng , Jung-Tsung Tseng , Che-Hua Hsu , Chih-Hao Yu , Tian-Fu Chiang , Yi-Wen Chen , Chien-Ming Lai , Cheng-Hsien Chou
- Main IPC: H01L47/00
- IPC: H01L47/00 ; H01L21/336

Abstract:
A method for fabricating a transistor having metal gate is disclosed. First, a substrate is provided, in which the substrate includes a first transistor region and a second transistor region. A plurality of dummy gates is formed on the substrate, and a dielectric layer is deposited on the dummy gate. The dummy gates are removed to form a plurality of openings in the dielectric layer. A high-k dielectric layer is formed to cover the surface of the dielectric layer and the opening, and a cap layer is formed on the high-k dielectric layer thereafter. The cap layer disposed in the second transistor region is removed, and a metal layer is deposited on the cap layer of the first transistor region and the high-k dielectric layer of the second transistor region. A conductive layer is formed to fill the openings of the first transistor region and the second transistor region.
Public/Granted literature
- US07888195B2 Metal gate transistor and method for fabricating the same Public/Granted day:2011-02-15
Information query
IPC分类: