Invention Application
- Patent Title: METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT
- Patent Title (中): 使用电线的毛细管内的气体流动的方法
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Application No.: US12500495Application Date: 2009-07-09
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Publication No.: US20100065963A1Publication Date: 2010-03-18
- Inventor: Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
- Applicant: Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
- Assignee: FORMFACTOR, INC.
- Current Assignee: FORMFACTOR, INC.
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Contact structures for a variety of electronic components can be formed to have primarily elastic properties. The contact structures can be free standing, and can be coupled to a variety of different electronic components such as a probe card assembly, a semiconductor wafer or dies, an interposer, or the like. Tips of the contact structures can have a topology that facilities contact with another electronic component.
Information query
IPC分类:
