发明申请
- 专利标题: WIRING STRUCTURE FOR USE IN MICRO PIEZOELECTRIC PUMP
- 专利标题(中): 微型压电泵使用的接线结构
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申请号: US12330367申请日: 2008-12-08
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公开(公告)号: US20100068080A1公开(公告)日: 2010-03-18
- 发明人: Hsien-Kai Meng , Shu-Pin Hsieh , Chieh-Ming Hsiung , Chien-Hua Lin , Yu-Chung Hsu , Tai-Shuan Lin
- 申请人: Hsien-Kai Meng , Shu-Pin Hsieh , Chieh-Ming Hsiung , Chien-Hua Lin , Yu-Chung Hsu , Tai-Shuan Lin
- 申请人地址: TW Taoyuan Hsien
- 专利权人: MICROBASE TECHNOLOGY CORP.
- 当前专利权人: MICROBASE TECHNOLOGY CORP.
- 当前专利权人地址: TW Taoyuan Hsien
- 优先权: TW097135312 20080915
- 主分类号: F04B35/04
- IPC分类号: F04B35/04 ; H02N2/04
摘要:
An electrical connection structure for use in a micro piezoelectric pump is disclosed. The electrical connection structure includes a driving circuit board and a multilayered wiring structure. The electrical connection structure includes the driving circuit board, the wiring structure, and a piezoelectric element arranged from top to bottom. The driving circuit board is provided with a driving circuit for driving the piezoelectric element and at least an electrical contact, wherein the electrical contacts are electrically connected to the driving circuit. A first electrode contact region and a second electrode contact region electrically insulated from each other are defined on the same surface of the piezoelectric element. The wiring structure sends a signal from the electrical contacts to the first electrode contact region and the second electrode contact region.
公开/授权文献
- US08162628B2 Wiring structure for use in micro piezoelectric pump 公开/授权日:2012-04-24
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