Invention Application
- Patent Title: PROCESS FOR SURFACE TREATING PLASTIC SUBSTRATE
- Patent Title (中): 表面处理塑料基板的工艺
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Application No.: US12536300Application Date: 2009-08-05
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Publication No.: US20100072058A1Publication Date: 2010-03-25
- Inventor: CHWAN-HWA CHIANG , BIN ZHANG , GANG XIONG , FENG-YUEN DAI , JENG-SHIUNG CHEN
- Applicant: CHWAN-HWA CHIANG , BIN ZHANG , GANG XIONG , FENG-YUEN DAI , JENG-SHIUNG CHEN
- Applicant Address: CN ShenZhen City HK Kowloon
- Assignee: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.,FIH (HONG KONG) LIMITED
- Current Assignee: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.,FIH (HONG KONG) LIMITED
- Current Assignee Address: CN ShenZhen City HK Kowloon
- Priority: CN200810304562.X 20080919
- Main IPC: C23C14/34
- IPC: C23C14/34 ; B05D3/00 ; C23C14/06
Abstract:
A process for surface treating a plastic substrate is provided. The method includes the steps of providing a plastic substrate; forming a golden-colored vacuum coated layer which is nonconductive on the plastic substrate; and forming a protective coating on the vacuum coated layer. A golden vacuum coated layer which is nonconductive is formed on the plastic substrate by the present process.
Information query
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