发明申请
- 专利标题： Stacking Quad Pre-Molded Component Packages, Systems Using the Same, and Methods of Making the Same
- 专利标题（中）： 堆叠四预成型组件包，使用相同的系统及其制作方法
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申请号： US12235227申请日： 2008-09-22
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公开(公告)号： US20100072590A1公开(公告)日： 2010-03-25
- 发明人: Yong Liu , Howard Allen , Qiuxiao Qian
- 申请人： Yong Liu , Howard Allen , Qiuxiao Qian
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L23/495
摘要：
Pre-molded component packages that may be as thin as a leadframe for a semiconductor die, systems using the same, and methods of making the same are disclosed. The leads of an exemplary package are exposed at both surfaces at the leadframe. The packages may be stacked upon one another and electrically coupled at the exposed portions of their leads.
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