发明申请
US20100072606A1 Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon Via and Method of the same
有权
具有嵌入式芯片的嵌入式封装结构和具有硅通孔的芯片及其方法
- 专利标题： Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon Via and Method of the same
- 专利标题（中）： 具有嵌入式芯片的嵌入式封装结构和具有硅通孔的芯片及其方法
-
申请号： US12385358申请日： 2009-04-06
-
公开(公告)号： US20100072606A1公开(公告)日： 2010-03-25
- 发明人: Wen-Kun YANG
- 申请人： Wen-Kun YANG
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/58
摘要：
The semiconductor device package structure includes a first die with a through silicon via (TSV) open from back side of the first die to expose bonding pads; a build up layer coupled between the bonding pads to terminal metal pads by the through silicon via (TSV); a substrate with a second die embedded inside and top circuit wiring and bottom circuit wiring on top and bottom side of the substrate respectively; and a conductive through hole structure coupled between the terminal metal pads to the top circuit wiring and the bottom circuit wiring.
公开/授权文献
信息查询
IPC分类:
