发明申请
- 专利标题： SENSOR NODE MODULE
- 专利标题（中）： 传感器节点模块
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申请号： US12242163申请日： 2008-09-30
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公开(公告)号： US20100078832A1公开(公告)日： 2010-04-01
- 发明人: Horst Theuss
- 申请人： Horst Theuss
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; G08B23/00 ; H01L23/31
摘要：
A method of manufacturing a sensor node module includes forming a protruding structure on a carrier. A sensor die is applied onto the protruding structure with an active sensing surface of the sensor die facing the carrier. The sensor die is encapsulated with mold material, wherein the protruding structure prevents the mold material from covering the active sensing surface. The carrier and the protruding structure are removed from the sensor die.
公开/授权文献
- US07759135B2 Method of forming a sensor node module 公开/授权日：2010-07-20
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