A light emitting device includes: a glass package (2) having a recess (5) in its center; a through-hole electrode (4) formed by filling a through hole (3), which is formed at a bottom of the recess (5), with a conductive material; a light emitting diode element (6) received in the recess (5) and mounted on the through-hole electrode (4); an insulating multilayer interference film (7) formed on an inner wall surface and a bottom surface of the recess (5); and a sealing material for sealing the light emitting diode element. With this structure, the light emitting device is improved in reliability.