Invention Application
- Patent Title: ADHESIVE LAYER FOR A BUBBLE-FREE ADHESIVE BOND
- Patent Title (中): 无粘性胶粘剂粘合剂层
-
Application No.: US12519544Application Date: 2007-12-07
-
Publication No.: US20100080945A1Publication Date: 2010-04-01
- Inventor: Klaus Kleinhoff , Christoph Nagel
- Applicant: Klaus Kleinhoff , Christoph Nagel
- Applicant Address: DE Hamburg
- Assignee: TESA SE
- Current Assignee: TESA SE
- Current Assignee Address: DE Hamburg
- Priority: DE102006062247.2 20061222
- International Application: PCT/EP2007/063501 WO 20071207
- Main IPC: B32B37/12
- IPC: B32B37/12 ; B32B3/26
Abstract:
The invention relates to an adhesive layer for a bubble-free adhesive bond, the adhesive layer being formed from an adhesive and there being at least one channel made in the surface of the adhesive, characterized in that the adhesive has expanded, and also to a method of producing a sheet-like structure that bonds without bubbles, wherein an adhesive is applied as an adhesive layer to a functional layer and wherein at least one channel is made in the surface of the adhesive, characterized in that the adhesive is expanded.
Information query
