发明申请
- 专利标题： THERMOSETTING DIE-BONDING FILM
- 专利标题（中）： 热成型贴膜
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申请号： US12529211申请日： 2008-02-04
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公开(公告)号： US20100081258A1公开(公告)日： 2010-04-01
- 发明人: Naohide Takamoto
- 申请人： Naohide Takamoto
- 优先权： JP2007-051767 20070301
- 国际申请： PCT/JP2008/051772 WO 20080204
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; B32B33/00 ; C08L101/00 ; C08L33/00 ; C08L63/00
摘要：
A thermosetting die-bonding film having excellent adhesion to an adherent and preferable pickup properties and a dicing die-bonding film having the thermosetting die-bonding film are provided. The thermosetting die-bonding film of the present invention is a thermosetting die-bonding film that is used when manufacturing a semiconductor device and contains 15 to 30% by weight of a thermoplastic resin component and 60 to 70% by weight of a thermosetting resin component as main components, wherein a surface free energy before heat curing is 37 mJ/m2 or more and less than 40 mJ/m2.
公开/授权文献
- US07829441B2 Thermosetting die-bonding film 公开/授权日：2010-11-09
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