发明申请
- 专利标题： HEAT DISSIPATION MODULE AND FAN THEREOF
- 专利标题（中）： 散热模块及风扇
-
申请号： US12634049申请日： 2009-12-09
-
公开(公告)号： US20100085711A1公开(公告)日： 2010-04-08
- 发明人: Hao-Wen Ko , Tsung-Yu Lei , Wen-Shi Huang
- 申请人： Hao-Wen Ko , Tsung-Yu Lei , Wen-Shi Huang
- 申请人地址： TW Taoyuan Hsien
- 专利权人： DELTA ELECTRONICS, INC.
- 当前专利权人： DELTA ELECTRONICS, INC.
- 当前专利权人地址： TW Taoyuan Hsien
- 优先权： TW095136868 20061004
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat dissipation module assembled with a circuit board is disclosed. The heat dissipation module assembled comprises a fan and at least a heat sink. The fan comprises a frame and an impeller. The frame comprises a body and at least an extension, wherein the extension protrudes from at least a side of the body. The impeller is disposed in the body. The heat sink is coupled to the extension for dissipating heat produced from an electronic element disposed on the circuit board, wherein the heat sink is received in the extension and disposed on the electronic element.
公开/授权文献
- US2528475A Electric testing apparatus 公开/授权日：1950-10-31
信息查询
