发明申请
US20100086721A1 SUPPORT STRUCTURE PACKAGING 有权
支持结构包装

SUPPORT STRUCTURE PACKAGING
摘要:
A method comprising building at least one three-dimensional model and a support structure using a layer-based additive technique, where the at least one three-dimensional model is at least partially encased in the support structure, and where the support structure functions as a shipping package for the at least one three-dimensional model.
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