Invention Application
US20100099240A1 DICING/DIE-BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
审中-公开
用于制造半导体芯片的定影/贴合胶带和方法
- Patent Title: DICING/DIE-BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
- Patent Title (中): 用于制造半导体芯片的定影/贴合胶带和方法
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Application No.: US12374285Application Date: 2007-07-19
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Publication No.: US20100099240A1Publication Date: 2010-04-22
- Inventor: Kouji Watanabe , Kazuyuki Shohara , Shota Matsuda , Masateru Fukuoka , Yoshiyuki Takebe
- Applicant: Kouji Watanabe , Kazuyuki Shohara , Shota Matsuda , Masateru Fukuoka , Yoshiyuki Takebe
- Priority: JP2006-197187 20060719; JP2006-254260 20060920; JP2006-306700 20061113; JP2006-311143 20061117; JP2007-110270 20070419
- International Application: PCT/JP2007/064239 WO 20070719
- Main IPC: H01L21/78
- IPC: H01L21/78 ; B32B33/00 ; B32B27/30 ; B32B5/16
Abstract:
Obtained is a dicing and die bonding tape that makes it possible to pick up a semiconductor chip easily and reliably in dicing a semiconductor wafer to pickup the semiconductor chip together with the whole die bonding film. A dicing and die bonding tape used in dicing of a wafer, in obtaining a semiconductor chip, and in die bonding of the semiconductor chip, the dicing and die bonding tape having a die bonding film 3, and a non pressure sensitive adhesive film 4 bonded on one surface of the die bonding film 3, the separation strength between the die bonding film 3 and the non pressure sensitive adhesive film 4 being within a range of 1 to 6 N/m, the shear strength between the die bonding film 3 and the non pressure sensitive adhesive film 4 being 0.3 to 2 N/mm2.
Information query
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