发明申请
- 专利标题： High Frequency Module for Filling Level Measurements in the W-Band
- 专利标题（中）： 用于W波段灌装液位测量的高频模块
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申请号： US12559835申请日： 2009-09-15
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公开(公告)号： US20100103024A1公开(公告)日： 2010-04-29
- 发明人: Daniel Schultheiss , Michael Fischer
- 申请人： Daniel Schultheiss , Michael Fischer
- 优先权： EP08167856.7 20081029
- 主分类号： G01S13/08
- IPC分类号： G01S13/08 ; G01F23/00
摘要：
A high-frequency module is for fill level measuring and for use at frequencies of more than 75 GHz. The high-frequency module comprises a microwave semiconductor, a printed circuit board and a housing bonded to the printed circuit board. In order to reduce the power required, operation of the microwave semiconductor takes place in a pulsed manner.
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