Various circuit board fluid cooling systems and methods of using the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a first member to a circuit board where the first member has a first opening with a first internal footprint. A heat exchanger is removably coupled to the first member to transfer heat from at least one component of the circuit board. The heat exchanger has an external footprint adapted so that at least a portion of the heat exchanger fits in the first opening. A plate is coupled to the circuit board to transfer heat from at least one component of the circuit board. A fluid supply line and a fluid return line are coupled to the heat exchanger such that one of the fluid supply line and the fluid return line is thermal contact with the plate to transfer heat therefrom.