发明申请
- 专利标题： Layered chip package with heat sink
- 专利标题（中）： 分层芯片封装带散热片
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申请号： US12289745申请日： 2008-11-03
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公开(公告)号： US20100109137A1公开(公告)日： 2010-05-06
- 发明人: Yoshitaka Sasaki , Hiroyuki Ito , Tatsuya Harada , Nobuyuki Okuzawa , Satoru Sueki , Hiroshi Ikejima
- 申请人： Yoshitaka Sasaki , Hiroyuki Ito , Tatsuya Harada , Nobuyuki Okuzawa , Satoru Sueki , Hiroshi Ikejima
- 申请人地址： US CA Milpitas JP Tokyo CN Hong Kong
- 专利权人： HEADWAY TECHNOLOGIES, INC.,TDK CORPORATION,SAE MAGNETICS (H.K.) LTD.
- 当前专利权人： HEADWAY TECHNOLOGIES, INC.,TDK CORPORATION,SAE MAGNETICS (H.K.) LTD.
- 当前专利权人地址： US CA Milpitas JP Tokyo CN Hong Kong
- 主分类号： H01L23/36
- IPC分类号： H01L23/36
摘要：
A layered chip package includes: a plurality of layer portions stacked, each of the layer portions including a semiconductor chip; and a heat sink. Each of the plurality of layer portions has a top surface, a bottom surface, and four side surfaces. The heat sink has at least one first portion, and a second portion coupled to the at least one first portion. The at least one first portion is adjacent to the top surface or the bottom surface of at least one of the layer portions. The second portion is adjacent to one of the side surfaces of each of at least two of the plurality of layer portions.
公开/授权文献
- US08154116B2 Layered chip package with heat sink 公开/授权日：2012-04-10
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