发明申请
- 专利标题: POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD
- 专利标题(中): 积极抵抗组成和图案形成方法
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申请号: US12593353申请日: 2008-03-27
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公开(公告)号: US20100112477A1公开(公告)日: 2010-05-06
- 发明人: Toshiaki Fukuhara , Hiromi Kanda , Shinichi Kanna
- 申请人: Toshiaki Fukuhara , Hiromi Kanda , Shinichi Kanna
- 申请人地址: JP Tokyo
- 专利权人: FUJIFILM CORPORATION
- 当前专利权人: FUJIFILM CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2007-085958 20070328; JP2008-076598 20080324
- 国际申请: PCT/JP2008/056622 WO 20080327
- 主分类号: G03F7/20
- IPC分类号: G03F7/20 ; G03F7/004
摘要:
A positive photosensitive composition comprises: (A) a resin that has an acid decomposable repeating unit represented by formula (I) and increases its solubility in an alkali developer by action of an acid; (B) a compound that generates an acid in irradiation with actinic light or radiation; (C) a resin that has: at least one of a fluorine atom and a silicon atom; and a group selected from the group consisting of groups (x) to (z); and (D) a solvent: (x) an alkali soluble group, (y) a group which decomposes by action of an alkali developer and increases a solubility of the resin (C) in an alkali developer, and (z) a group which decomposes by action of an acid, wherein, Xa1 represents a hydrogen atom, an alkyl group, a cyano group or a halogen atom, Ry1 to Ry3 each independently represents an alkyl group or a cycloalkyl group, and at least two of Ry1 to Ry3 may be coupled to form a ring structure, and Z represents a divalent linking group.
公开/授权文献
- US08034537B2 Positive resist composition and pattern forming method 公开/授权日:2011-10-11
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