Embodiments described herein provide lid structures for medical implant (MI) housing. In one embodiment, the invention provides a lid structure for a MI housing comprising a substrate comprising a dielectric material, a conductive portion fabricated on a substrate surface or interior, a frame at least partially surrounding the substrate perimeter, a plurality of vias projecting at least partially through the substrate, a plurality of conductive pins with at least one pin projecting through a via. The frame is hermetically joined to the substrate and can be hermetically joined to the housing. The conductive portion allows electrical components, including capacitors, inductors, resistor and antennas to be fabricated on or coupled to the substrate surface or interior. The antenna comprises a conductive trace positioned on a substrate top surface and is configured to send and receive signals between an implant within a patient's body and a communication device external to the body.