发明申请
- 专利标题: High Humidity Crimping Process
- 专利标题(中): 高湿度压接工艺
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申请号: US12692529申请日: 2010-01-22
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公开(公告)号: US20100115759A1公开(公告)日: 2010-05-13
- 发明人: Stephen Dirk Pacetti
- 申请人: Stephen Dirk Pacetti
- 主分类号: B21D39/04
- IPC分类号: B21D39/04 ; B23P11/00
摘要:
A method of producing a stent-balloon assembly is disclosed which includes providing a stent having a polymeric component; exposing the stent to a relative humidity of 20% to 100%; and crimping the stent on a balloon of a catheter assembly. The polymeric component could be at least part of the material from which the stent is made or could be a constituent of a coating for the stent, such as a drug delivery coating. In lieu of or in addition to the application of humidity, a plasticizing agent can be applied to the polymeric component. A crimping device is also disclosed which allows the stent to be exposed to humidity during the crimping process.
公开/授权文献
- US08020273B2 High humidity crimping process 公开/授权日:2011-09-20
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