A multi-chip package includes a carrier, a first chip, a relay circuit substrate, a number of first bonding wires, a number of second bonding wires, a second chip, a number of third bonding wires, and an adhesive layer. The first chip is disposed on the carrier. The relay circuit substrate is disposed on the first chip. The first bonding wires are electrically connected between the first chip and the relay circuit substrate. The second bonding wires are electrically connected between the relay circuit substrate and the carrier. The second chip is disposed on the carrier and is stacked with the first chip. The third bonding wires are electrically connected between the second chip and the carrier. The adhesive layer is adhered between the first chip and the second chip. In addition, a manufacturing method of a multi-chip package is also provided.