A SMC lamination line is disclosed that has an upper carrier film and a lower carrier film with oriented chopped fibers being deposited between the carrier films. Resin paste or adhesive is provided to retain oriented fibers on the lower carrier film. A guide roller guides the carrier film in close proximity to an in-feed conveyor that feeds oriented chopped fiber unto the lower carrier film. The guide roller is preferably less than the diameter of the end roller of the feed conveyor. The guide roller is also preferably within the arc of movement of the ends of the oriented chopped fibers to ensure a smooth and non-disruptive transfer of the oriented chopped fibers to the lower carrier film.