发明申请
- 专利标题： LIGHT EMITTING DIODE PACKAGE
- 专利标题（中）： 发光二极管封装
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申请号： US12570703申请日： 2009-09-30
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公开(公告)号： US20100127302A1公开(公告)日： 2010-05-27
- 发明人: Tae Jun KIM , Young Suk Han , Won Ho Jung
- 申请人： Tae Jun KIM , Young Suk Han , Won Ho Jung
- 专利权人： SAMSUNG LED CO., LTD.
- 当前专利权人： SAMSUNG LED CO., LTD.
- 优先权： KR10-2008-0119099 20081127
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A light emitting diode package according to an aspect of the invention may include: a body receiving a light emitting diode; a lead electrically connected to the light emitting diode; and an adapter receiving a modified electrode electrically connected to the lead so that the polarity of the modified electrode is changed into the polarity of the lead, the adapter in which the body is received and fixed.
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